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MST2 (Fach) / MST2 (Lektion)
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- Plot the relation between bending radius and maxmum stress for a wafer, as a function of the wafer thickness. Assume the wafer is made of silicon, with Young modulus ESi = 150 GPa, and Poisson ratio ν = 0.17. (Hint: When bending a wafer substrate, we can consider it a very wide beam. For a comparison with thin glas you may use a Young modulus of ESi = 73 GPa). x
- Describe the operation of a silicon Hall sensor within the framework of a sensor cube model (coupled effects). Include the effects of stress, temperature, magnetic field, and electrical biasing. x
- Plot the relation between bending radius and maxmum stress for a wafer, as a function of the wafer thickness. Assume the wafer is made of silicon, with Young modulus ESi = 150 GPa, and Poisson ratio ν = 0.17. (Hint: When bending a wafer substrate, we can consider it a very wide beam. For a comparison with thin glas you may use a Young modulus of ESi = 73 GPa). x
- Describe the operation of a silicon Hall sensor within the framework of a sensor cube model (coupled effects). Include the effects of stress, temperature, magnetic field, and electrical biasing. x
- Give two examples of devices who operation is based on coupled effects. Briefly describe the couple effects in each case. c
- Describe the key components of a system. c
- Name 5 different material shape processes that are used for microstructuring. List examples from consumer products that use the processes? x
- Explain phenomenologically the mathematical relationship between film thickness and rotation during a spincoating process. Which material properties govern the thickness, and why? c
- Describe the forces that act during a Langmuir-Blodgett coating process. c
- What is the difference between dispensing and inkjet printing? x
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- Describe three uses of lasers within microstructuring processes. For each example, describe why the laser provides an advantage. x
- Describe how a ceramic part is formed via injection moulding. How accurate is the shape? What can be done to improve the accuracy? x
- Describe the process steps of silicon wafer-to-wafer bonding using plasma activation. cv
- Lamination has many unit operations (more than are listed in the script!). Name four that are particularly useful for microstructuring, and why x
- Describe in detail how to structure a chromium micro-pattern on a silicon wafer using photolithography and evaporation techniques. x
- Explain and sketch how to avoid misalignment of consecutive photolithography steps. c
- Give three pausible reasons for patterning errors in lithography. c
- Name and describe four material response mechanisms that are useful for nanolithography. c
- What are two key properties of nanoimprint lithography moulds, and why? f
- What is the Abbe ́ limit and how is it overcome by 2PP nanolithography? Describe the key difference between 2PP and 2PP-STED nanolithography. Explain the STED operating principle. ff
- Briefly describe the working principles of each of the four major probe-based nanolithography systems: Local oxidation, Dip pen, Fountain pen, Thermal desorption. f
- Name four scalable additive manufacturing technologies. f
- Briefly describe the working principles of each of the four major probe-based nanolithography systems: Local oxidation, Dip pen, Fountain pen, Thermal desorption. f
- Name four scalable additive manufacturing technologies. c
- Name the two rapid prototyping categories, as well as four key groups of rapid prototyping technologies. Name one example of each technology. cc
- FDM. Make a schematic and briefly explain the operation of fused deposition modelling (FDM) technique. Give two examples of using FDM in combination with functional materials. What are the resolution limits of FDM? f
- Make a schematic and briefly explain the operation of the selective laser sintering (SLS) technique. Identify two features of laser sintering in general. d
- Make a schematic and briefly explain the operation of the ink-based direct writing (DW) technique. Name four applications of this technique. Also describe at least one printhead type. c
- What is the difference between additive and subtractive processes? c
- Explain the cycle of a rapid prototyping procedure. f
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- Name four features of micro milling. c
- Name and explain two limitations of micro milling. dd
- Why is a dielectric liquid used in EDM dd
- Name two material reasons for introducing water jet cutting. gt
- Name four advantages of using laser machining. rg
- Name four potential benefit areas of rapid prototyping. ef
- Sketch the steps of a typical PCB fabrication process. d
- Describe the principal reason for self-rolling of material films. d
- How can the rolling of a MEMS film be initialized in the rolled up MEMS process? s
- List four characteristics/properties of wirebonding that enables the use of this method as an unconventional but usable MEMS fabrication process. e
- What are the principal differences between Wedge and Ball Wirebonding? d
- Sketch the process steps for a complete ball-wedge wirebond. e
- Why is paper a good material for MEMS? dd
- Name two operation modes of focused ion beam. d
- Why is gallium typically used as a liquid metal source for focused ion beams? d
- Name three reasons why are ions (in general) being used in the focused ion beam technology. s
- How can the etch rate of a focused ion beam be improved? dd
- Describe briefly the basics of the atomic layer deposition (ALD) process. Mention two characteristics of the layers obtained through the ALD process. d
- Why is the layer growth in ALD (atomic layer deposition) limited? gg
- What polymer group is used for injection moulding? dd